E3D Revo Micro Heatsink Framework and it takes over 3000g

and it takes over 3000g of force to dislodge the bed from the adapter plate

16KG) ISO 1133 TBD Mechanical Properties Test Methodology Values Tensile Strength ISO 527 TBD Elongation at break ISO 527 TBD Flexural Modulus ISO 527 TBD Flexural Strength ISO 178 TBD Impact Strength ISO 180 TBD Thermal Dynamic Properties Test Methodology Values HDT@ 0

Turnaround time on a panel order is 2-10 business days

Compact Design

Change nozzles at room temperature using just your fingers

E3D Revo Micro Heatsink Framework and it takes over 3000gSwap nozzles without complex tools and hot tightening with this innovative new HotEnd ecosystem from E3D, FDM 3D printing extrusion system experts. Revo Micro Heatsink