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Ships within 48 hours · Estimated delivery Aug 13 - Aug 18
An oriental woodsy blend that is just brilliant
• Brightness Adjustment: There are 3 brightness levels
• 【Elegant Polka Dot Pattern Design】Features beautiful polka dot pattern design
• 【Anti-RFID Theft Protection】Equipped with advanced technology to prevent unauthorized scanning of your cards
• 【Precision Engineered Dimensions】Optimally sized at 240x57x12mm to provide maximum cleaning coverage while maintaining maneuverability
BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9 Color:As Shown An oriental woodsy blend thatFeatures & Specifications Made by high quality metal material Easy and quickly for reballing the BGA IC Excellent to replace IC or BGA rework reballing Compatible with Universal Models Universal Package included 1 x BST iPH 2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S 6SP A9